capacity enhancement 結果共3筆

Discover how Taiwan’s National Environmental Research Academy is addressing the demand for green talent with its Net-Zero Emission Capacity Enhancement Class, filling up quickly due to high demand. Learn about the initiative’s focus on equipping individuals for the green sector and supporting green careers.

Taiwan High Speed Rail Corporation (THSRC) will be adding 21 weekly train services, with 11 heading southbound and 10 going northbound, starting on January 3, 2024. This expansion plan will bring the total number of weekly train services to 1,060 for passengers. Tickets for these additional services can be purchased starting from midnight on December 6. The aim of this service enhancement is to improve the travel experience for passengers north of Taichung, especially during peak commute hours and tourist seasons. The additional train services primarily target business commuters during weekdays. THSRC has previously executed two ＂regular service increase＂ plans in July and October, raising the fixed weekly services from 1,016 to 1,025 and then further to 1,039. In addition, a ＂short-term service increase＂ plan was implemented in November and December. THSRC intends to monitor the outcomes of this short-term increase to guide future adjustments in long-term service offerings. This initiative reflects THSRC’s commitment to adapting its services to the evolving travel patterns and needs of the public, aiming for greater convenience and efficiency for its users.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.